Application: | Electronic Ceramics |
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Type: | Ceramic Plates |
Thermal Conductivity: | 180 |
Material: | Aluminun Nitride Ceramics |
Transport Package: | Foam Package |
Specification: | L0.5~200MM*W0.5~200MM*T0.1~2MM |
Samples: |
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Aluminum Nitride Ceramics Properties | |||
Color | Gray | Density | 3.26g/cm3 |
Melt Point | 2200ºC | Boiling Point | 2517ºC |
Thermal Conductivity | 320 W/m.K | Thermal expansion coefficient | 3.5×10-6K-1 |
Specific heat | 740J/(Kg.ºC) | Volume resistivity | >1014Ω.cm |
Dielectric constant | 8.2~9@1Hz | Hardness(Mohs) | 9~10 |
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