Tianjin, China
Business Type:
Registered Capital:
500000 RMB
Plant Area:
101~500 square meters
Management System Certification:
ISO 9001, ISO 9000, GMP
Average Lead Time:
Peak season lead time: one month
Off season lead time: within 15 workdays
Sample Available

Electric Ceramics Circuit Boards, Electronics Ceramics Circuit Boards, Ceramics Metallization Substrate manufacturer / supplier in China, offering Electric and Electronics Ceramics Circuit Boards Ceramics Metallization Substrate, High Density MGO Magnesia Ceramics Tube, Metalization (Au Cu AG Sn etc) of Aln Aluminum Nitride Ceramics Plate and so on.

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Supplier Homepage Products Ceramics circuit boards Electric and Electronics Ceramics Circuit Boards Ceramics Metallization Substrate

Electric and Electronics Ceramics Circuit Boards Ceramics Metallization Substrate

Min. Order / Reference FOB Price
10 Pieces US $0.1-100/ Piece
Port: Tianjin, China
Production Capacity: 50000
Payment Terms: L/C, T/T, Western Union, Paypal
Type: Electric and Electronics
Material: Ceramics
Raw Material: Aln/Al2O3/Zro2
Technique: Dry Press, CIP, Hip, Cim
Theme: Industrial
Style: Classical

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Basic Info.

Thermostability, Thermal Insulation, Structral
Making Method
Machine Made
Textile, Chemical Industry, Electron, Electrical Appliance, Construction, Hygienic
HS Code
Ceramic circuit boards are actually based on electronic ceramics, include the material of Alumina Nitride (AlN) , Alumina (Al2O3), BeO, Quartz , Sapphire, Silicone Carbide(SiC) , Silicone Nitride(Si3N4) , Yttria(Y2O3) or Magnesia(MgO) partially stabilized Zirconia(Y-PSZ/Mg-PSZ), 
can be made of various shapes. Among them, the ceramic circuit board has the most outstanding characteristics of high temperature resistance and high electrical insulation performance. It has the advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability and close to the thermal expansion coefficient of the components. The fabrication of ceramic circuit board will use LAM technology, that is, laser fast activation metallization technology. Applications in the field of LED, high power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, high frequency switching power supplies, solid state relays Automotive electronics, communications, aerospace and military electronic components.
Ceramic materials have excellent high frequency and electrical properties, high thermal conductivity, excellent chemical stability and thermal stability, etc. It is an ideal packaging material for new generation large scale integrated circuits and power electronic modules.
1. Higher thermal conductivity
2. More matching coefficient of thermal expansion
3. A firmer, less resistive metal film.
4. The solderability of the substrate is good and the use temperature is high.
5. Good insulation
6. Low loss at high frequency
7. High density assembly
8. Free of organic components, cosmic ray resistant, high reliability in aerospace, long service life
9. Copper layer does not contain oxide layer, can be used in reductive atmosphere for a long time
Chemical Composition94.
2 WhiteYellowIvoryWhiteGrayBlackGrayWhiteWhite
3(g/cm3)6.05 5.70 3.90 3.70 3.20 3.20 3.26 2.00 2.90
4(%)0 0 4.90 0 0 0 0 0 0
Water Absorption
5 999 8.8 99.59.52/
Hardness Mohs
6(Kg/mm2)1300 1100 1850 1400 1600 2200 1200 /1200
Hardness Vickers
7(Gpa)200 250 360 300 300 440 300 //
Young's Modulus
8(MPa)1250 450 400 300 720 450 300 35 220
Bending Strength
9(Mpa*M1/3)10.0 6.5 4.5 3.0 7.0 3.9 3.3 //
Fracture Toughness
10(MPa)3000 2500 2500 2000 2500 1800 2100 //
Compressive Strength
11(10-6/K)10.0 10.0 7.5 7.5 3.2 3.0 3.5 1.0 8.0
Expansion Coefficient
12(W/mK)3 3 30 20 20 120 >17075 280
Thermal Conductivity
13 20.0 28.0 9.8 9.0 8.3 9.7 9.0 4.0 7.0
Dielectric Constant
Volume Resistivity
Electric and Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
Electric and Electronics Ceramics Circuit Boards Ceramics Metallization Substrate

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