Electronics Ceramics Circuit Boards Ceramics Metallization Substrate

Product Details
Type: Electric and Electronics
Material: Ceramics
Raw Material: Aln/Al2O3/Zro2
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Number of Employees
3
Year of Establishment
2015-12-28
  • Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
  • Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
  • Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
  • Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
  • Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
  • Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
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Basic Info.

Model NO.
Substrate-17
Technique
Dry Press, CIP, Hip, Cim
Theme
Industrial
Style
Classical
Function
Thermostability, Thermal Insulation, Structral
Making Method
Machine Made
Usage
Textile, Chemical Industry, Electron, Electrical Appliance, Construction, Hygienic
Size
Customized
Advantage
Long Service Life
Applicable
Electronics
Color
Golden
Transport Package
Plastic Bag, Wooden Box
Specification
20*20*20cm
Trademark
yinghua
Origin
China
HS Code
8534001000
Production Capacity
50000

Packaging & Delivery

Package Size
20.00cm * 20.00cm * 20.00cm
Package Gross Weight
1.000kg

Product Description

Ceramic circuit boards are actually based on electronic ceramics, include the material of Alumina Nitride (AlN) , Alumina (Al2O3), BeO, Quartz , Sapphire, Silicone Carbide(SiC) , Silicone Nitride(Si3N4) , Yttria(Y2O3) or Magnesia(MgO) partially stabilized Zirconia(Y-PSZ/Mg-PSZ), 
can be made of various shapes. Among them, the ceramic circuit board has the most outstanding characteristics of high temperature resistance and high electrical insulation performance. It has the advantages of low dielectric constant and dielectric loss, high thermal conductivity, good chemical stability and close to the thermal expansion coefficient of the components. The fabrication of ceramic circuit board will use LAM technology, that is, laser fast activation metallization technology. Applications in the field of LED, high power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, intelligent power components, high frequency switching power supplies, solid state relays Automotive electronics, communications, aerospace and military electronic components.
Ceramic materials have excellent high frequency and electrical properties, high thermal conductivity, excellent chemical stability and thermal stability, etc. It is an ideal packaging material for new generation large scale integrated circuits and power electronic modules.
1. Higher thermal conductivity
2. More matching coefficient of thermal expansion
3. A firmer, less resistive metal film.
4. The solderability of the substrate is good and the use temperature is high.
5. Good insulation
6. Low loss at high frequency
7. High density assembly
8. Free of organic components, cosmic ray resistant, high reliability in aerospace, long service life
9. Copper layer does not contain oxide layer, can be used in reductive atmosphere for a long time
 
ITEM 1 2 3 4 5 6 7 8 9
Y-TZP MgO-PSZ Al2O3 Si3N4 SiC AlN BN BeO
1 (%) ZrO2 Y2O3 ZrO2 MgO Al2O3 Al2O3 / / / / /
Chemical Composition 94.6 5.2 96.5 3.5 99.6 96 / / / / /
2   White Yellow Ivory White Gray Black Gray White White
Color
3 (g/cm3) 6.05 5.70 3.90 3.70 3.20 3.20 3.26 2.00 2.90
Density
4 (%) 0 0 4.90 0 0 0 0 0 0
Water Absorption
5   9 9 9 8.8 9 9.5 9.5 2 /
Hardness Mohs
6 (Kg/mm2) 1300 1100 1850 1400 1600 2200 1200 / 1200
Hardness Vickers
7 (Gpa) 200 250 360 300 300 440 300 / /
Young's Modulus
8 (MPa) 1250 450 400 300 720 450 300 35 220
Bending Strength
9 (Mpa*M1/3) 10.0 6.5 4.5 3.0 7.0 3.9 3.3 / /
Fracture Toughness
10 (MPa) 3000 2500 2500 2000 2500 1800 2100 / /
Compressive Strength
11 (10-6/K) 10.0 10.0 7.5 7.5 3.2 3.0 3.5 1.0 8.0
Expansion Coefficient
12 (W/mK) 3 3 30 20 20 120 >170 75 280
Thermal Conductivity
13   20.0 28.0 9.8 9.0 8.3 9.7 9.0 4.0 7.0
Dielectric Constant
14 (Ω·Cm) >1012 >1014 >1015 >1014 >1014 >103 >1014 >1014 >1013
Volume Resistivity


Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
 
Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
Electronics Ceramics Circuit Boards Ceramics Metallization Substrate
The products series include kinds of new materials such as structural products and functional ceramic products, such as Alumina, Aluminum Nitride, Zirconia, Silicon Nitride and Boron Nitride ceramics are the main products in the list. Zirconia derivative products such as high purity zirconia, Yttria stabilized zirconia(YSZ or Y-TZP), and Magnesia stabilized Zirconia(MgO-PSZ), and Ceria stabilized Zirconia(CeO-PSZ), structural zirconia ceramics, etc. For the zirconia products have many excellent properties such as high hardness, high strength and toughness, super low chemical and mechanical corrosive, insulated in common temperature, and magnetic proofing, so they are extensively applied in optic, electronic, mechanical and chemical industry, etc. And Alumina ceramics is more widely applied in industrial.

Tianjin
Yinghua Material Tech Co.,Ltd is located in Tianjin City, China, which is the economic center of north China and with a convenient transportation and excellent business service.

The company insists the spirit of Products Innovating, Technology Service and Customer Value, and wish to develop with the customers and suppliers. All customers and friends are welcome!


Electronics Ceramics Circuit Boards Ceramics Metallization SubstrateElectronics Ceramics Circuit Boards Ceramics Metallization SubstrateElectronics Ceramics Circuit Boards Ceramics Metallization Substrate

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